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TEM Study of the Interface Between HIPed Silicon Nitride and Encapsulation Borosilicate Glass
Malmö högskola, School of Technology (TS).
2000 (English)In: Journal of Materials Science, ISSN 0022-2461, E-ISSN 1573-4803, p. 2847-2854Article in journal (Refereed)
Place, publisher, year, edition, pages
2000. p. 2847-2854
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Materials Engineering
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URN: urn:nbn:se:mau:diva-2450Local ID: 4814OAI: oai:DiVA.org:mau-2450DiVA, id: diva2:1399203
Available from: 2020-02-27 Created: 2020-02-27 Last updated: 2022-06-27Bibliographically approved

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Wei, Liu-Ying

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